| 摘要 |
PURPOSE: An LED package and a manufacturing method thereof are provided to improve the problem a structure in which a first molding part is formed through a first resin injection port and a second molding part is formed through a second resin injection port. CONSTITUTION: A lead frame(22) is electrically connected to an LED chip. A cavity(211) equipped with one or more level differences(212) is formed in the inner wall of housing(21). The cavity comprises a first cavity(211a) which accepts the LED chip and a second cavity(211b) which is wider than the first cavity. Resin gates(213a-213d) which are connected to the cavity are formed in the lower side of the level difference. A plurality of molding units(25,26) is formed within the cavity by resin which is injected through the resin gate.
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