| 摘要 |
<p>The component (1) has four heat guiding elements (11-14) exhibiting thermally and electrically conductive characteristics, where the first guiding element is arranged at a top side and a lower side of a semiconductor element (2). The second and third guiding elements are arranged at a top side and a lower side of another semiconductor element (3), respectively. A cooling body (15) is provided in contact with a cooling agent (18), where the third and fourth guiding elements are connected with the cooling body. A solder joint is arranged between the guiding and semiconductor elements. The semiconductor elements are designed as MOSFET components, insulated gate bipolar transistor (IGBT) components, diodes, thyristors or gross domestic product (GDP) components, and the heat guiding elements are designed as printed circuit boards or ceramic substrates.</p> |
