STENCIL FOR STRAIN ANALYZING AND PATTERNING METHOD USING THE SAME

摘要

PURPOSE: A stencil for strain analyzing and a patterning method using the same are provided to efficiently etch a large-sized thin plate material by fixing a separation film having magnetic force to the thin plate material. CONSTITUTION: A stencil for strain analyzing is wound in a roll shape and comprises a sheet-shaped separation film(1) and separation film fixing members(2). Multiple grooves are formed in the sheet-shaped separation film in a latticed shape and have points or patterns. The separation film fixing members fix the separation film to a thin plate material using magnetic force.