| 摘要 |
Disclosed is a method and apparatus for testing the mounting of an integrated circuit 16 on a printed circuit board 12 using a ball grid array. The method comprises directing an inclined laser beam 34 from a line scan laser a laser measurement device 28 at the integrated circuit 16 and detecting the position of the lower edge of the integrated circuit from laser light backscattered from the integrated circuit and printed circuit board. The determination is conducted through a trigonometric calculation to obtain the height of the integrated circuit above the printed circuit board following soldering of the ball grid array. The determined height may be compared reference data. The integrated circuit is deemed to have been successfully mounted to the printed circuit board if the height falls within a predetermined range. |
