发明名称 |
Bumping free flip chip process |
摘要 |
Methods, systems, and apparatuses for an integrated circuit package assembly process are provided. A wafer is received having a surface defined by a plurality of integrated circuit regions. Electrical conductors are accessible through corresponding first openings in a first passivation layer on the surface of the wafer. Solderable metal layer features are formed on the electrical conductors through the first openings. The wafer is singulated to form a plurality of flip chip dies. A plurality of package substrates is received. Each package substrate has a plurality of solder on pad (SOP) features on a respective surface. Each flip chip die is mounted to a corresponding package substrate such that each SOP feature is coupled to a corresponding solderable metal layer feature, to form a plurality of integrated circuit packages. |
申请公布号 |
US8088647(B2) |
申请公布日期 |
2012.01.03 |
申请号 |
US20100783855 |
申请日期 |
2010.05.20 |
申请人 |
HU KUNZHONG (KEVIN);LAW EDWARD;BROADCOM CORPORATION |
发明人 |
HU KUNZHONG (KEVIN);LAW EDWARD |
分类号 |
H01L21/44;H01L21/00;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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