发明名称 Bonded body, bonding material composition, honeycomb segment bonded body, and honeycomb structure using the same
摘要 There is provided a bonding material composition capable of suppressing crack generation on an end face of a resultant honeycomb structure to a large extent by reducing anisotropy of Young's modulus after curing of the bonding material by the use of an isotropic filler without using inorganic fibers. The bonded body has two or more members unitarily bonded by means of a bonding material layer, and the relational expression of 0.5<Ez/Ex<1.5 is satisfied when a Young's modulus in a direction perpendicular to a bonded surface of the bonding material layer is Ez and a Young's modulus in a direction parallel to the bonded surface and parallel to a longer axial direction of the bonded surface is Ex and wherein the bonded material has a porosity of 25 to 85%.
申请公布号 US8088702(B2) 申请公布日期 2012.01.03
申请号 US20080235379 申请日期 2008.09.22
申请人 TOMITA TAKAHIRO;MORIMOTO KENJI;NGK INSULATORS, LTD. 发明人 TOMITA TAKAHIRO;MORIMOTO KENJI
分类号 C04B38/00;B01D39/06;B32B3/12 主分类号 C04B38/00
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