发明名称 |
Conductive particles for anisotropic conductive interconnection |
摘要 |
Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle. Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.
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申请公布号 |
US8089151(B2) |
申请公布日期 |
2012.01.03 |
申请号 |
US20060500018 |
申请日期 |
2006.08.07 |
申请人 |
JUN JUNG BAE;PARK JIN GYU;LEE HEUNG SE;CHEIL INDUSTRIES, INC. |
发明人 |
JUN JUNG BAE;PARK JIN GYU;LEE HEUNG SE |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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