EPOXY RESIN COMPOSITION, PREPREG, METAL FOIL WITH RESIN, RESIN SHEET, LAMINATE AND MULTI-LAYER BOARD

摘要

An epoxy resin composition is provided having the necessary flame retardancy and heat resistance for a laminate or multilayer board, and having superior dielectric properties without exhibiting any decrease in interlayer adhesiveness. The epoxy resin composition contains a polyfunctional epoxy resin (A), a polyphenylene ether compound (B) and a phosphorus-modified curing agent (C). A polyphenylene ether (B1) having a number-average molecular weight of 500 to 3000 and an average of 1.0 to 3.0 hydroxyl groups per molecule, and an epoxy resin (B2) obtained by reacting this polyphenylene ether (B1) with an epoxy resin (D) having an average of 2.3 or fewer epoxy groups per molecule and the like, are included as the polyphenylene ether compound (B). A phosphorus-modified epoxy resin (P) is included in at least one selected from the polyfunctional epoxy resin (A), the epoxy resin (D) and a component other than the (A), (B) and (C) above. The phosphorus content is 1.5 to 4.5 mass% as a percentage of the resin solids in the epoxy resin composition.