| 发明名称 |
Device comprising electrode pad |
| 摘要 |
A pad structure 100 includes an electrode pad (a first electrically conducting film 104 and a second electrically conducting film 110) and an insulating film provided over a peripheral region of the electrode pad so as to surround the electrode pad, and the insulating film has a structure including a protective film (a cover oxide film 106) and a transparent resin film (a transparent resin 108) provided on the cover oxide film 106. |
| 申请公布号 |
US8089165(B2) |
申请公布日期 |
2012.01.03 |
| 申请号 |
US20090430557 |
申请日期 |
2009.04.27 |
| 申请人 |
MORIYA TARO;NAKASHIBA YASUTAKA;UCHIYA SATOSHI;FURUMIYA MASAYUKI;RENESAS ELECTRONICS CORPORATION |
发明人 |
MORIYA TARO;NAKASHIBA YASUTAKA;UCHIYA SATOSHI;FURUMIYA MASAYUKI |
| 分类号 |
H01L23/48;H01L27/14;H01L21/301;H01L21/3205;H01L23/485;H01L23/52;H01L23/544;H01L27/146 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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