| 摘要 |
PURPOSE: A semiconductor package is provided to efficiently emit heat which is generated in each semiconductor chip by automatically forming the thickness of a TIM(Thermal Interface Material) to be thin with a shape memory alloy. CONSTITUTION: One or more semiconductor chips(102a,102b) are stacked on a substrate(100). A lead(106) is arranged to cover stacked semiconductor chips on the substrate. An adhesive member(104a) is placed between the substrate and the lead. A heat transfer member(104b) is placed between the utmost top semiconductor chip of one or more stacked semiconductor chips and the lead. A shape memory alloy(108) applies pressure to the heat transfer member.
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