发明名称 WAVELENGTH CONVERTED LIGHT EMITTING DIODE CHIP AND METHOD OF MANUFACTURING THE SAME
摘要 PURPOSE: A wavelength converted light emitting diode chip and a manufacturing method thereof are provided to minimize color temperature deviation according to directional angles by producing a uniform light emitting property. CONSTITUTION: A plurality of LED chips(20) is attached to the chip layout area in the upper side of a temporary supporting plate(11). Conductive bumps(28a,28b) are formed on the electrode of each LED chip. A resin encapsulation part(29') with a fluorescent substance is formed in the chip layout area to cover the conductive bumps. The resin encapsulation part containing the fluorescent substance is ground so that the conductive bumps are exposed to the upper side of the resin encapsulation part containing the fluorescent substance. A wavelength converted LED chip(30) is formed between LED chips by cutting the resin encapsulation part containing the fluorescent substance.
申请公布号 KR20120000291(A) 申请公布日期 2012.01.02
申请号 KR20100060584 申请日期 2010.06.25
申请人 SAMSUNG LED CO., LTD. 发明人 KIM, YONG TAE;INOUE TOMIO;KIM, JE WON;TSUTSUI TSUYOSHI;LEE, JONG HO;CHAE, SEUNG WAN
分类号 H01L33/50 主分类号 H01L33/50
代理机构 代理人
主权项
地址