| 摘要 |
<p>PURPOSE: A stacked package is provided to reduce the height of an entire stacked package by forming a locking tape on the upper side part of a semiconductor chip which is arranged in an utmost top part. CONSTITUTION: Two or more semiconductor chips(110) are placed on a substrate(100). A connecting member(120) electrically connects the semiconductor chips and the substrate. A locking tape(130) is formed on the semiconductor chip except for a bonding pad part. A sealing member(140) seals the one side of the substrate which includes the locking tape, the connecting member, and the semiconductor chips. An outer connection member(150) is formed in the other side of the substrate which faces the one side of the substrate.</p> |
