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经营范围
发明名称
轻质晶圆环
摘要
申请公布号
TWM420041
申请公布日期
2012.01.01
申请号
TW100207339
申请日期
2011.04.26
申请人
刘得江
发明人
刘得江
分类号
H01L21/677
主分类号
H01L21/677
代理机构
代理人
林文烽 台北市大安区罗斯福路2段49号12楼
主权项
一种轻质晶圆环,其具有一呈环状之框体,该框体系以一玻璃纤维增强尼龙材质构成,其中该框体之外缘具有:至少一凹槽;以及至少一平坦区。如申请专利范围第1项所述之轻质晶圆环,其中所述框体之厚度为1.5mm至2.5mm。如申请专利范围第1项所述之轻质晶圆环,其中该玻璃纤维增强尼龙材质之玻璃纤维含量为尼龙之30%。如申请专利范围第1项所述之轻质晶圆环,其中该玻璃纤维增强尼龙材质之玻璃纤维含量为尼龙之15%至40%。
地址
新竹市中央路255巷1号2楼之1
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