发明名称 |
Electronic Devices with Yielding Substrates |
摘要 |
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. |
申请公布号 |
US2011315956(A1) |
申请公布日期 |
2011.12.29 |
申请号 |
US201113171973 |
申请日期 |
2011.06.29 |
申请人 |
TISCHLER MICHAEL;SCHICK PHILIPPE;ASHDOWN IAN;SHEEN CALVIN WADE;JUNGWIRTH PAUL |
发明人 |
TISCHLER MICHAEL;SCHICK PHILIPPE;ASHDOWN IAN;SHEEN CALVIN WADE;JUNGWIRTH PAUL |
分类号 |
H01L33/06;H01L33/40;H01L33/48;H01L33/60 |
主分类号 |
H01L33/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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