| 摘要 |
A solder ball mounting apparatus includes a hopper, a mounting head provided at a tip of the hopper, and a pressing pin which is insertable inside the hopper and the mounting head. The mounting head has an inner diameter which restricts movement of solder balls, and when one of the solder balls is supplied to the mounting head through the hopper, the pressing pin presses one of the solder balls, thereby mounting the solder balls one by one on a target member. |
