发明名称 |
MEMORY DIES, STACKED MEMORIES, MEMORY DEVICES AND METHODS |
摘要 |
Memory die, stacks of memory dies, memory devices and methods, such as those to construct and operate such die, stacks and/or memory devices are provided. One such memory die includes an identification configured to be selectively coupled to an external select connection node depending on how the die is arranged in a stack. The identification circuit can determine an identification of its respective memory die responsive to how, if coupled, the identification circuit is coupled to the external select connection node. |
申请公布号 |
WO2011100444(A3) |
申请公布日期 |
2011.12.29 |
申请号 |
WO2011US24368 |
申请日期 |
2011.02.10 |
申请人 |
MICRON TECHNOLOGY, INC.;NAKANISHI, TAKUYA;ITO, YUTAKA |
发明人 |
NAKANISHI, TAKUYA;ITO, YUTAKA |
分类号 |
G11C29/00;G06F11/30 |
主分类号 |
G11C29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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