CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM
摘要
<p>A diluent-free curable epoxy resin composition for preparing a composite comprising: (A) at least one epoxy resin composition comprising a blend of: (A1) at least one epoxy resin, and (A2) at least one divinylarene dioxide; and (B) at least one hardener composition; and (C) at least one reinforcement materials; wherein the viscosity of the curable composition is the range of from about 0.15 Pa-s to about 1.5 Pa-s; and wherein the curable composition is adapted for providing a cured composite product made from the curable composition such that the composition being cured provides a cured composite product having an increased Tg of greater than about 5 °C as compared to a curable composition having a reactive diluent.</p>
申请公布号
WO2011163282(A2)
申请公布日期
2011.12.29
申请号
WO2011US41318
申请日期
2011.06.22
申请人
DOW GLOBAL TECHNOLOGIES LLC;THEOFANOUS, THEOFANIS;VERGHESE, KANDATHIL, E.;JACOB, GEORGE
发明人
THEOFANOUS, THEOFANIS;VERGHESE, KANDATHIL, E.;JACOB, GEORGE