CERAMIC PACKAGING BASE BOARD

摘要

A ceramic packaging base board comprises a packaging substrate (1), a circuit layout layer printed on the substrate (1) and a fixed packaging layer. The circuit layout layer comprises at least one metallic paste region (3), and at least one compensated metallic paste region (4) corresponding to the metallic paste region (3) disposed on the blank region (2) where the metallic paste region (3) does not exist. By adding a compensated metallic paste region symmetrical to the metallic paste region, it is possible to reduce the mechanical strength and efficiently improve the distortion of the base board.