COMPOUND, RESIN AND PHOTORESIST COMPOSITION

摘要

The present invention provides a compound represented by the formula (I): wherein R1 represents a hydrogen atom or a methyl group, A1 represents a single bond or *—(CH2)m—CO—O—in which m represents an integer of 1 to 4 and * represents a binding position to—O—, B1 represents—O—or—S—, B2 represents—CH2—,—O—or—S—and W1 represents an optionally substituted aromatic ring, a resin comprising a structural unit derived from the compound and a photoresist composition comprising the resin.