| 摘要 |
The present invention relates to a driving IC, which is installed on a substrate and includes an input electrode, forming on an installation surface of the driving IC for inputting signal; an output electrode, forming on the installation surface for outputting signal; an input signal control circuit section, connected to the input electrode and formed outside the formed area of the input electrode; an output signal control circuit section, connected to the output electrode and formed outside the formed area of the output electrode; dummy bumps, formed between the input signal control circuit section and the output signal control circuit section on the installation surface. Thus, connection failure and damage of the driving IC caused by a non-uniformity of a bump arrangement density can be reduced. |
