GROUP-MOUNTING METHOD FOR SMT ELECTRONIC COMPONENTS

摘要

A group-mounting method for mounting surface mount technology (SMT) electronic components on a circuit board in groups is provided. The method includes: making a group-mounting-nozzle according to the position spacing between the electronic components required to be mounted on the circuit board, sucking a group of electronic components synchronously using the group-mounting-nozzle, aligning the position spacing between the electronic components which are required to be mounted on the circuit board and synchronously placing the group of electronic components on the corresponding position on the circuit board. When the position spacing between the components on a tape which packages the components is the same as that between the components required to be mounted on the circuit board, the group-mounting-nozzle sucks a group of components directly from the tape synchronously. When the position spacing between the components on the tape is different from that between the components required to be mounted on the circuit board, a direction changing template is provided to make sure that the position spacing between the components on the direction changing template is the same as that between the components required to be mounted on the circuit board, and the group-mounting-nozzle sucks a group of components synchronously from the direction changing template. The group-mounting-nozzle can be used on a traditional SMT surface mounting machine. This method improves the production efficiency and reduces the cost.