发明名称 |
Package for an Implantable Neural Stimulation Device |
摘要 |
The present invention is an improved hermetic package for implantation in the human body. The implantable device comprises an electrically non-conductive substrate; a plurality of electrically conductive vias through said electrically non-conductive substrate; a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a first subset of said plurality of electrically conductive vias, wherein said flip-chip circuit contains one or more stacks or a folded stack; a wire bonded circuit attached to said electrically non-conductive substrate and electrically connected to a second subset of said electrically conductive vias; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
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申请公布号 |
US2011319963(A1) |
申请公布日期 |
2011.12.29 |
申请号 |
US201113224104 |
申请日期 |
2011.09.01 |
申请人 |
OK JERRY;GREENBERG ROBERT J.;TALBOT NEIL HAMILTON;LITTLE JAMES SINGLETON;DAI RONGQING;NEYSMITH JORDAN MATTHEW;MCCLURE KELLY H. |
发明人 |
OK JERRY;GREENBERG ROBERT J.;TALBOT NEIL HAMILTON;LITTLE JAMES SINGLETON;DAI RONGQING;NEYSMITH JORDAN MATTHEW;MCCLURE KELLY H. |
分类号 |
A61F9/08 |
主分类号 |
A61F9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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