| 摘要 |
Provided is a sputtering device that, as well as providing a function that forms an even thickness laminated film on a flat substrate surface, is able to evenly form, even on a substrate formed by an uneven structure, a layer that attaches to the sides or wall surfaces of the uneven structure. The sputtering device set forth in one embodiment of the invention is provided with a substrate holder (22) that rotatably holds a substrate (21), a cathode unit (40) that is arranged in a position diagonally opposite the substrate holder (22), a position sensor (23) that detects the rotation position of the substrate held on the substrate holder, and a holder rotation control unit (51) for adjusting the rotation angle of the substrate according to the detected rotation position. The holder rotation control unit (51) controls rotation speed in such a manner that the substrate rotation speed when the cathode unit (40) is positioned facing a first direction, which is the long direction of the processing face of the uneven structure, is slower than the substrate rotation speed when the cathode unit (40) is positioned facing a second direction, which is perpendicular to the first direction in the direction of substrate rotation. |
