| 摘要 |
PURPOSE: A thermal treating apparatus and a thermal treating method are provided to uniformly form the line-width of wiring patterns on the surface of a substrate and to suppress of the variation of thermal treating temperature in the substrate. CONSTITUTION: A horizontally transferring substrate along a substrate transferring path is detected before the substrate is introduced into a first chamber(S1). The transferring position of the substrate is recognized based on the detection of the substrate. The front region and the rear region of the substrate are divided. Cool air is sprayed toward the front region and the rear region of the substrate(S3). Cool air is stopped when the center region of the substrate is introduced into the first chamber(S4, S5). The temperatures of the front region and the rear region of the substrate are lower than the temperature of the center region of the substrate. |
