NANOSCOPIC ASSURANCE COATING FOR LEAD-FREE SOLDERS
摘要
<p>NANOSCOPIC ASSURANCE COATING FOR LEAD-FREE SOLDERSNanoscopic silicon containing agents including polyhedral oligomeric silsesquioxane and polyhedral oligomeric silicate are used to eliminate the formation of conductive metal whiskers at the surface of lead-free solders joints and atom migration in semiconductors.FIG. 5</p>
申请公布号
SG176498(A1)
申请公布日期
2011.12.29
申请号
SG20110085412
申请日期
2007.08.15
申请人
HYBRID PLASTICS, INC.
发明人
LICHTENHAN, JOSEPH, D.;LEE, ANDRE;HAIT, SUKHENDU, B.
