发明名称 |
CORRUGATED DIE EDGE FOR STACKED DIE SEMICONDUCTOR PACKAGE |
摘要 |
A semiconductor die and semiconductor package formed therefrom, and methods of fabricating the semiconductor die and package, are disclosed. The semiconductor die includes an edge formed with a plurality of corrugations defined by protrusions between recesses. Bond pads may be formed on the protrusions. The semiconductor die formed in this manner may be stacked in the semiconductor package in staggered pairs so that the die bond pads on the protrusions of a lower die are positioned in the recesses of the upper die.
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申请公布号 |
US2011316164(A1) |
申请公布日期 |
2011.12.29 |
申请号 |
US20100825617 |
申请日期 |
2010.06.29 |
申请人 |
LIAO CHIH-CHIN;YU CHEEMAN |
发明人 |
LIAO CHIH-CHIN;YU CHEEMAN |
分类号 |
H01L25/065;H01L21/60;H01L23/538 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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