POLYAMIDE COMPOSITION FOR SURFACE-MOUNTED COMPONENTS

摘要

Polyamide composition for surface-mounted components. The present invention relates to compositions for surface-mounted components (SMCs) comprising at least: A) a semiaromatic polyamide modified by a hydroxyaromatic compound; B) reinforcing fillers; and C) a flame retardant. These compositions have many advantages linked to the uses thereof in lead-free reflow soldering processes, in particular a good dimensional stability and a blistering resistance during the use of articles produced from these compositions.