| 发明名称 |
Metal ink composition and method for forming the metal line using the same, and conductive pattern formed by using the metal ink composition |
| 摘要 |
The present invention provides a metal ink composition, which includes 20 to 80 parts by weight of cupper nano-particle; 10 to 70 parts by weight of non-aqueous organic solvent; and 2 to 20 parts by weight of additive used for adjustment of the dry speed of coated metal ink when metal lines are formed. |
| 申请公布号 |
US2011318541(A1) |
申请公布日期 |
2011.12.29 |
| 申请号 |
US20100923619 |
申请日期 |
2010.09.29 |
| 申请人 |
KIM TAE HOON;SEO YOUNG KWAN;KIM DONG HOON;JUN BYUNG HO;KIM SUNG EUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM TAE HOON;SEO YOUNG KWAN;KIM DONG HOON;JUN BYUNG HO;KIM SUNG EUN |
| 分类号 |
C09D11/02;B05D5/12;B32B3/10 |
主分类号 |
C09D11/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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