Disclosed is a power conversion device comprising: first, second, and third semiconductor modules provided in each phase of a three-phase inverter circuit and which house upper and lower armature series circuits; and a parallelepiped-shaped flowpath-forming case with an electronic component-housing space and a refrigerant flowpath formed so as to enclose the electronic component-housing space. The refrigerant flowpath has a first flowpath provided along a first side surface of the flowpath-forming case, a second flowpath provided along a second side surface adjacent to one side of the first side surface and connected to one end of the first flowpath, and a third flowpath provided along a third side surface adjacent to the other side of the first side surface and connected to the other end of the first flowpath. The first semiconductor module is positioned on the first flowpath so as to be parallel to the first side surface; the second semiconductor is positioned on the second flowpath so as to be parallel to the second side surface; and the third semiconductor module is positioned on the third flowpath so as to be parallel to the third side surface.
