CURABLE COMPOSITION AND METHOD FOR PRODUCING CURED FILM

摘要

Disclosed is a curable composition which can be sufficiently cured without a heating step at high temperature, has excellent solvent resistance and is capable of producing a cured film with a low dielectric constant. The curable composition comprises a fluorine-containing polyarylene prepolymer (A) having a crosslinkable functional group, a compound (B) which contains no fluorine atom, while having a number-average molecular weight of 140-5,000 and two or more crosslinkable functional groups, a copolymer (C) having a unit (c1) and a unit (c2), and a radical polymerization initiator (D). The unit (c1) may have an etheric oxygen atom between carbon atoms, has a fluoroalkyl group having 20 or less carbon atoms and does not have a crosslinkable functional group. The unit (c2) has a crosslinkable functional group.