| 摘要 |
<p>A light emitting diode packaging structure and manufacturing method thereof are provided. The structure comprises a substrate (10), a first transparent glue layer (20), a second transparent glue layer (30), light emitting diode(LED) chips (40), fluorescent glue (50) and encapsulating glue (60), wherein the LED chips are located inside the enclosed plane pattern of the first transparent glue layer, the enclosed plane pattern of the second transparent glue layer surrounds the first transparent glue layer, the fluorescent glue covers the LED chips, the encapsulating glue covers the substrate, the first transparent glue layer and the fluorescent glue, the height of the first transparent glue layer is larger than the height of the LED chips, and the height of the second transparent glue layer is larger than the height of the first transparent glue layer. Therefore, the packaging structure avoids usage of a bracket, and has a wider light source emission angle. It can simplify the whole structure and further improve light emission efficiency.</p> |
