发明名称 MANUFACTURING METHOD OF VERTICAL STRUCTURE LED DEVICE
摘要 PURPOSE: A method for manufacturing a vertical structure type light emitting diode is provided to prevent stress applied to a semiconductor layer by a nitrogen gas and a gallium seed, thereby increasing a yield and enhancing device features. CONSTITUTION: A semiconductor layer(120) is formed on a substrate(110). A p-type electrode(130) is formed on the semiconductor layer. A pattern connected from the p-type electrode to the substrate has a fixed depth. A support layer(140) is formed on the p-type electrode. The pattern is exposed by grinding the lower surface of the substrate. The substrate is separated from the semiconductor layer.
申请公布号 KR20110138566(A) 申请公布日期 2011.12.28
申请号 KR20100058514 申请日期 2010.06.21
申请人 HEESUNG ELECTRONICS CO., LTD. 发明人 KIM, JONG HWAN
分类号 H01L33/02 主分类号 H01L33/02
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