STACK TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A stack type semiconductor package is provided to improve productivity by shortening a time requiring laminating chips and bonding a wire without changing a working position of the wire bonding. CONSTITUTION: In a stack type semiconductor package, a first connection pad(112) and a second connection pad(113) are included in the top side of a substrate(110). A first cascade chip laminate(120) comprises a first semiconductor chip(121) which is loaded in the top side of substrate in a multi-stage. The second cascade chip laminate(130) comprises a second semiconductor chip(131) which is loaded by on the top of the first cascade chip laminate the medium of the junction(140). The junction is bonded together with the first cascade chip laminate and the second cascade chip laminate The Junction comprises a film layer(141) having a FOW(Film Over Wire) property.