APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES

摘要

PURPOSE: An apparatus for manufacturing semiconductor devices is provided to implement a molecular bond for high yield 3D integration circuit by suppressing deformation generating the twist bond of the wafer. CONSTITUTION: In a apparatus for manufacturing semiconductor devices, a combining module(1) provides the bond of wafers under less than atmospheric. The vacuum within a vacuum chamber of a combination module is comprised of a vacuum pump(3). The vacuum pump is connected to the vacuum chamber of a combination module through a control valve(4). A load lock module(2) transfers the wafer to the combination module. The load lock module comprises a first gate(7) and a second gate(8). The first vacuum pump(5) reduces the pressure within the load lock module to less than the atmospheric.