EPOXY RESIN COMPOSITION

摘要

Provided is an epoxy resin composition which contains a reactive diluent that, when added even in a small amount, can yield a low-viscosity solution, and which can provide cured products superior in heat resistance and mechanical properties to those of an epoxy resin containing no reactive diluent. An epoxy resin composition which comprises 100 parts by weight of an epoxy resin exhibiting a viscosity of 1000mPa·s or higher at 25°C and 1 to 90 parts by weight of a polyepoxyethylbenzene; and cured products obtained by adding a curing agent to the epoxy resin composition and subjecting the resulting epoxy resin composition to curing.