发明名称 Device for cooling electrical elements
摘要 The device has a heat sink (1) for an electrical component (4), where a coolant flows through the heat sink. The electrical component comprises a base surface and a side surface, where the base surface faces the heat sink. A connection is provided between guiding bodies (3, 5) and the side surface of the component and between the guiding bodies and the heat sink. The guiding bodies extend perpendicular to a section of the heat sink.
申请公布号 EP1835251(B1) 申请公布日期 2011.12.28
申请号 EP20070003615 申请日期 2007.02.22
申请人 BEHR GMBH & CO. KG 发明人 DAMSOHN, HERBERT, DR.-ING.;HECKENBERGER, THOMAS, DR.-ING.;ISERMEYER, TOBIAS;LUZ, KLAUS, DIPL.-ING.;PFENDER, CONRAD, DR.-ING.
分类号 F28D1/03;F28F3/02;H01M8/04;H01M10/50 主分类号 F28D1/03
代理机构 代理人
主权项
地址
您可能感兴趣的专利