| 摘要 |
<p>PURPOSE: A method and an apparatus for removing a reversibly mounted device wafer from a carrier substrate are provided to remove a device wafer from a carrier substrate after processing the rear side of the wafer under low force. CONSTITUTION: In a method and an apparatus for removing a reversibly mounted device wafer from a carrier substrate, stack architecture(10) comprises a first substrate(12) and a second substrate(22). The first substrate has a device surface(14), a rear side(16), and an outmost edge(17). The second substrate comprises a carrier surface(24), a rear side(26), and an outer edge(27). A filling layer is arranged between the device surface and the surface of the carrier. The filling layer and the edge combination unit are arranged in the same substrate.</p> |
