发明名称 |
Metal-polishing liquid and polishing method |
摘要 |
A metal-polishing liquid used for chemical-mechanical polishing of a conductor film of copper or a copper alloy in a process for manufacturing a semiconductor device, the metal-polishing liquid comprising: (1) an amino acid derivative represented by the formula (I); and (2) a surfactant, wherein, in the formula (I), R1 represents an alkyl group having 1 to 4 carbon atoms and R2 represents an alkylene group having 1 to 4 carbon atoms. |
申请公布号 |
US8083964(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20080055930 |
申请日期 |
2008.03.26 |
申请人 |
YAMADA TORU;KIKUCHI MAKOTO;INABA TADASHI;MATSUNO TAKAHIRO;TOMIGA TAKAMITSU;TAKAHASHI KAZUTAKA;FUJIFILM CORPORATION |
发明人 |
YAMADA TORU;KIKUCHI MAKOTO;INABA TADASHI;MATSUNO TAKAHIRO;TOMIGA TAKAMITSU;TAKAHASHI KAZUTAKA |
分类号 |
C03C15/00;B24B37/00;C09K3/14;H01L21/304 |
主分类号 |
C03C15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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