发明名称 Exposure apparatus inspection method and method for manufacturing semiconductor device
摘要 A mask pattern includes a first pattern having a line-and-space pattern extending in a first direction, a second pattern formed as a line-and-space pattern having a larger period than the first pattern and extending in the first direction, a third pattern having a line-and-space pattern extending in a second direction, and a fourth pattern formed as a line-and-space pattern having a larger period than the third pattern and extending in the second direction. Illumination light is obliquely incident on the first pattern and the second pattern from a first oblique direction, illumination light is obliquely incident on the third pattern and the fourth pattern from a second oblique direction, and a relative distance from the first pattern to the second pattern transferred on to an image receptor and a relative distance from the third pattern to the fourth pattern transferred onto the image receptor are measured and an optical characteristic of an exposure apparatus is ascertained based on the relative distances.
申请公布号 US8085393(B2) 申请公布日期 2011.12.27
申请号 US20090554782 申请日期 2009.09.04
申请人 KASA KENTARO;SATO TAKASHI;FUKUHARA KAZUYA;KABUSHIKI KAISHA TOSHIBA 发明人 KASA KENTARO;SATO TAKASHI;FUKUHARA KAZUYA
分类号 G01N11/00 主分类号 G01N11/00
代理机构 代理人
主权项
地址