发明名称 |
Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor |
摘要 |
A process for replacing a semiconductor chip of such a flip-chip module and a suitable flip-chip module and an apparatus for implementing the method are disclosed. The flip-chip module comprises at least one semiconductor chip and a substrate. The semiconductor chip comprises contact posts on a surface that are disposed at right angles to the surface. With these contact posts it is connected with contact points of the substrate via a soldered connection. The contact posts completely cover the contact points with their end faces. Due to this it is possible to completely press the solder between the contact posts and contact points out of the intermediate area between the contact points and the contact posts after a renewed heating. This permits a renewed attachment of a further semiconductor chip. |
申请公布号 |
US8084298(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20080190342 |
申请日期 |
2008.08.12 |
申请人 |
WEISSBACH ERNST-A;ERTL JUERGEN;HTC BETEILIGUNGS GMBH |
发明人 |
WEISSBACH ERNST-A;ERTL JUERGEN |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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