LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode package is provided to have a package mold member using a thermosetting resin, thereby increasing heat emitting efficiency. CONSTITUTION: A lead frame(20) comprises a first lead member(21) and a second lead member(22). A package mold member(10) receives parts of the first and second lead members. Electrode units are formed on right and left edges of the first and second lead members. A reflective unit reflects light of an LED chip. The reflective unit is placed on the package molding member. The LED chip is mounted on the bottom of a metal cup(24) of the second lead member.