| 摘要 |
FIELD: physics. ^ SUBSTANCE: in an electronic module, having a substrate with a printed circuit of conductors, lying on the face and back sides of the substrate, contact pads, and electronic components lying on the front surface of the substrate and electrically connected according to the circuit, the electronic components also lie on the back side of the substrate. There is at least one additional substrate placed on any of the sides of the substrate, and an electrical connection between the substrate and the additional substrate is provided through at least one electronic component, whose leads lie on the substrate as well as on the additional substrate. A flexible printed-circuit board is used as at least one additional substrate. ^ EFFECT: design of a reliable electronic module with high wiring density owing to installation of additional substrates for electronic components. ^ 2 cl, 1 dwg |
