发明名称 |
Method and article of manufacture for wire bonding with staggered differential wire bond pairs |
摘要 |
A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.
|
申请公布号 |
US8084857(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20100692209 |
申请日期 |
2010.01.22 |
申请人 |
APPEL GAVIN;REBELO ASHLEY;WITTENSOLDNER CHRISTOPHER J.;AGERE SYSTEMS |
发明人 |
APPEL GAVIN;REBELO ASHLEY;WITTENSOLDNER CHRISTOPHER J. |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|