发明名称 |
Method of implementing a capacitor in an integrated circuit |
摘要 |
A method of implementing a capacitor in an integrated circuit package is disclosed. The method comprises coupling the capacitor to a first surface of a substrate of the integrated circuit package; positioning an integrated circuit die over the capacitor, wherein the integrated circuit die has a first plurality of solder bumps and a second plurality of solder bumps separated by a region having no solder bumps; coupling the integrated circuit die to the first surface of the substrate over the capacitor, wherein the region having no solder bumps is positioned over the capacitor; and encapsulating the integrated circuit die and the capacitor.
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申请公布号 |
US8084297(B1) |
申请公布日期 |
2011.12.27 |
申请号 |
US20100851522 |
申请日期 |
2010.08.05 |
申请人 |
JOSHI MUKUL;NAGARAJAN KUMAR;XILINX, INC. |
发明人 |
JOSHI MUKUL;NAGARAJAN KUMAR |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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