发明名称 |
Light emitting diode package |
摘要 |
There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes. |
申请公布号 |
US8084778(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20090571751 |
申请日期 |
2009.10.01 |
申请人 |
PAEK HO SUN;KIM HAK HWAN;LEE YOUNG JIN;KIM HYUNG KUN;JUNG SUK HO;SAMSUNG LED CO., LTD. |
发明人 |
PAEK HO SUN;KIM HAK HWAN;LEE YOUNG JIN;KIM HYUNG KUN;JUNG SUK HO |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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