| 摘要 |
PURPOSE: A method for inspecting defects of a power layer and a ground layer of a circuit board is provided to obtain pattern characteristics of a power layer and a ground layer and extract the type of possible defects, thereby reducing inspection time. CONSTITUTION: A method for inspecting defects of a power layer and a ground layer of a circuit board is as follows. Data about perforated holes of a circuit board is input(S41). The patterns of one or more power layers and one or more ground layers of the circuit board are scanned and an image file is created(S42). The image file is composed with the perforated hole data(S43). The position relation between the pattern contours of the power layers or ground layers and a part of the perforated holes is obtained. Defects are determines based on the position relation(S44).
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