THREE-DIMENSIONALLY STACKED PACKAGE AND THE FABRICATION METHOD THEREOF

摘要

PURPOSE: A 3D stacked package and a manufacturing method thereof are provided to stably protect a semiconductor chip mounting area, thereby preventing deterioration and damage of the package. CONSTITUTION: A flexible board(20) comprises a conductive pattern(2) for electrical connection with the outside of a unit object. A semiconductor chip(10) is mounted on one side where the conductive pattern is formed. A cavity penetrates a rigid plate(30). The rigid plate is attached to the flexible board by a non conductive adhesive(3). The thickness(t1) of the rigid plate is bigger than the thickness(t2) of the semiconductor chip.