| 摘要 |
PURPOSE: A method for manufacturing an LED substrate is provided to suppress bubbles which are generated during a hog bonding process, thereby preventing damage of an electrode. CONSTITUTION: A coupling layer is formed on a ceramic substrate(20) with a via hole(30). An inverse phase pattern of an electrode pattern is formed on the coupling layer by a photo process. An electrode pattern is formed in a groove part of the inverse phase pattern corresponding to the electrode pattern. The inverse phase pattern and the coupling layer of a part except the electrode pattern are eliminated. A high reflection material is coated on the ceramic substrate.
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