APPARATUS FOR SCRIBING A SUBSTRATE AND METHOD FOR SCRIBING THE SUBSTRATE USING THE SAME

摘要

PURPOSE: A substrate cutting apparatus and a substrate cutting method using the same are provided to improve the efficiency of a substrate cutting process by including a first blade and a second blade which are composed in order to have a different cutting condition each other. CONSTITUTION: A cutting part comprises a first blade(112) and a second blade(114). The first blade is perpendicularly arranged about a substrate(10). The second blade is parallel to the first blade. A driving part(120) respectively runs the first blade and the second blade. A controller(130) controls the driving part so that the second blade cuts a scribe region of the substrate in which a first blade cuts while the second blade follows the first blade. A first rotating axis rotates the first blade by being combined with the first blade. A second rotating axis rotates the second blade by being combined with the second blade.