发明名称 APPARATUS FOR POLISHING REAR SURFACE OF SUBSTRATE, SYSTEM FOR POLISHING REAR SURFACE OF SUBSTRATE, METHOD FOR POLISHING REAR SURFACE OF SUBSTRATE AND RECORDING MEDIUM HAVING PROGRAM FOR POLISHING REAR SURFACE OF SUBSTRATE
摘要 PURPOSE: A substrate back side grinding apparatus, a substrate back side grinding system, a substrate back side grinding method and a recording medium recording the substrate back side grinding program are provided to prevent the degradation of substrate when grinding the rear side of substrate. CONSTITUTION: A substrate back side grinding apparatus comprises a substrate grinding unit(16,17) and a control unit. The substrate grinding unit grinds the back side of a substrate(5). The control unit controls the substrate grinding unit. The control unit controls the driving of the substrate grinding unit according to the information about treatment in the process before substrate back side grinding process. The substrate grinding unit has various kinds. A cleaning unit is equipped for cleaning the back side of the substrate.
申请公布号 KR20110137719(A) 申请公布日期 2011.12.23
申请号 KR20110037383 申请日期 2011.04.21
申请人 TOKYO ELECTRON LIMITED 发明人 NAKAMORI MITSUNORI;UCHIDA NORITAKA;ORII TAKEHIKO;MIYAZAKI TAKANORI;MOURI NOBUHIKO
分类号 B24B29/00;B08B7/04;B24B51/00;H01L21/304 主分类号 B24B29/00
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